Business Analytics, Statistical Programming, Other
IC Assembling and Testing subcon
I am Ramanan, BE Mechanical Engineering, with over 6.5 yrs of Manufacturing/Process / Maintenance experience.
I have been working with semiconductor assembly industries for the past 6 years.
My experience includes IC assembling and smart card module assembling. I am currently working with Stats Chippac Ltd an IC assembly and Test sub con as Senior Associate Project engineer in Singapore.
My key project success is US$4M soft saving on wire-bond (one of the stage in IC Assembling) through UPH and Utilization improvement.
I have more than 2 yrs experience in working with JMP tool for data analysis. I also have experience in JMP scripting to automate repeated analysis to reduce man hours spending hrs daily on analysis.
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